Plating Process
UBM plating
Electroless Ni and Au plating on Al pad
We support up to 12 inch wafers
| No. | Processing process | Corresponding range (feature) |
| 1 | Pad surface cleaning | Dry・wet,dry + wet treatment possible,Remove the passivation film remaining on the pad. |
| 2 | Al etching | Corresponding to thin film pad |
| 3 | Zincate treatment | |
| 4 | Electroless Ni plating | |
| 5 | Electroless Pd plating | Also support Ni/Pd/Au plating |
| 6 | Electroless Au plating | Corresponding to cyan no-cyan / substitution reduction various plating solution. |
| Thick attachment Au plating for wire bonding is also possible. |
