It is an essential technology for semiconductor and MEMS substrate processing.
It is also used in fields such as glass crafts, but two processes of dry and wet have been established and it is possible to pattern various materials.
Etching is performed by bombarding ions with a reactive gas at high speed.
- Micro hole forming for TSV by Deep-RIE.
- High speed machining by Bosch process.
- High aspect processing possible.
Various metal films available.
- Etching of oxide film and nitride film
Etching is performed by using chemical reaction in solution.
※We have various chemical solutions.
Single crystal silicon anisotropic etching
V-groove, angular groove
Single crystal silicon isotropic etching
Metal thin film etching
Various metals available (Ni, Pt, Cu, Ti, Cr, Al, W, Au, Ag, Ta etc.)