FOWLP Prototype Processing Service

We accept a series of prototype development of FOWLP package from chip mounting / molding process to rewiring process.



▶ Features of FOWLP

  1. Package area is larger than semiconductor chip area
  2. Terminals can be extended outside the chip
  3. Shuttle flight wafer chip small piece prototype (Fan-in) re-wiring, bump processing and dicing are also available.

▼Chip mounted   ▼Molding  ▼Rewiring + Bump processing ▼Dicing