FOWLP Prototype Processing Service
We accept a series of prototype development of FOWLP package from chip mounting / molding process to rewiring process.
▶ Features of FOWLP
- Package area is larger than semiconductor chip area
- Terminals can be extended outside the chip
- Shuttle flight wafer chip small piece prototype (Fan-in) re-wiring, bump processing and dicing are also available.
▼Chip mounted ▼Molding ▼Rewiring + Bump processing ▼Dicing