About CMP

CMP (Chemical Mechanical Planarization) is an indispensable technology for fabricating multilayer wiring wafers. This page introduces the scope of CMP application, including processing examples.

Purpose of CMP

As the number of multilayer wiring layers increases, the irregularities on the IC surface increase and the step becomes larger. The thickened step becomes a film thickness at the time of film forming, the focus at exposure does not match, and it becomes difficult to form a fine pattern. Therefore, CMP is indispensable as surface flattening technology.

Application of CMP

Flattening of interlayer insulating film

Before CMP(PE-TEOS)
Before CMP(PE-TEOS)
After CMP(PE-TEOS)
After CMP(PE-TEOS)

Damascene process

1μmLINE
1μmLINE
10μmLINE
10μmLINE

TSV

Before CMP
Before CMP
After CMP
After CMP
Surface condition
Surface condition

Improvement of surface roughness before bonding

 Before CMP
Before CMP
After CMP
After CMP