Dear customers and suppliers,
CEO Hirohito Watanabe
Announcement of headquarters relocation
We are delighted that you are prospering. Thank you very much for your continued support.
Now, we are expanding new business (new equipment installation and clean room expansion) of FOWLP (Fan Out Wafer Level Package). Headquarters will be relocated on August 11th to the address below.
Therefore, if you would like to contact us after August 11th, please contact the address below.
In addition, we apologize for the inconvenience, but please change the mailing address. (Please send the board etc. to our factory as before.)
*The telephone number and fax number will not change.
*At same time of headquarters relocation, telephone and internet lines will be relocated.
It is expected that you may temporarily inconvenience, but thank you for your understanding.
If you have any questions, please do not hesitate to contact us.
All the employees will continue to do their utmost to meet the demands of our customers. We would appreciate your continued patronage in the future.
1. New Headquarters address
Sohken Hon-atsugi Building 4F, 3-18-5 Naka-chou, Atsugi-shi, Kanagawa 243-0018, Japan.
The factory address does not change.
2. No change in telephone number and fax number.
TEL 046-244-6467 (Representative) / TEL 046-244-6468 (Direct) FAX 046-244-6469
3. Business start date August 17th 9:00 onwards (Aug 12th – 16th summer holidays)
4. For inquiries regarding relocation, please contact the person in charge below.
Mr. Wada e-mail : firstname.lastname@example.org mobile : 080-3932-0742